Structure
Layer Count 1, 2, 4, 6, 8, 10,12 1, 2, 4, 6, 8, 10, 12, 14, 16
HDI Techno- For Sample Run Production
Board Thickness(Min) 24mil 24mil
Board Thickness(Max) 126mil 126mil
Copper Foil
Copper foil outer layer 1/2oz-10oz 1/2oz-10oz
Copper foil inner layer 1/2oz-4oz 1/2oz-4o/z
Drill
Plating hole tolerance +/-3mil +/-3mil
Non-plating hole tolerance +/-2mil +/-2mil
Min. Drill Bit 0.25mm 0.25mm
Dielectric thickness
Core thickness (Min) 3mil 3mil
Dielectric thickness (prepreg) 2mil 2mil
Finished board thickness tolerance +/-10% FBT>=50mil

+/-12% 24mil=<FBT<50mil

+/-3mil FBT<24mil

+/-10% FBT>=50mil

+/-12% 24mil=<FBT<50mil

+/-3mil FBT<24mil

Solder mask
Solder Mask Dam (Min) 3mil 3mil
Solder Mask Opening (Min) 2.5mil 2.5mil
Solder Mask plug hole size 0.3mm-0.7mm 0.25mm-0.7mm
Registration Capability
Layer to Layer 3mil 3mil
Plating Capability
Aspect Ratio (Mechanical) 10 : 1 12 : 1
Aspect Ratio (Laser) 0.8 : 1 0.8 : 1
Electrical / RF Capability
Min line width/space (Inner ½ oz) 4mil / 4mil 4mil / 4mil
Min line width/space (Inner 1oz) 4mil / 4mil 4mil / 4mil
Min line width/space (Outer 1/2oz) 4mil / 4mil 4mil / 4mil
Line tolerance +/-20% +/-20%
Impedance
Impedance Control YES YES
Impedance Tolerance +/-10% +/-10%
Outline
Routing tolerance +/-5mil +/-5mil
Punching tolerance +/-4mil +/-4mil
V-cut angle 30degree, 45degree, 60degree 30degree, 45degree, 60degree
V-cut tolerance +/-3degree +/-3degree
V-cut web thickness tolerance +/-3mil +/-3mil
Surface Finished
OSP Yes Yes
Immersion Gold Yes Yes
Immersion Silver Yes Yes
Lead Free HASL / HASL Yes Yes
Immersion Tin Yes Yes
E-Test
Test Voltage 25v-250v 25v-250v
Insolation resistance 2M ohms- 100M ohms 2M ohms- 100M ohms
Continuity 5 ohms – 1k ohms 5 ohms – 1k ohms