Structure | ||
Layer Count | 1, 2, 4, 6, 8, 10,12 | 1, 2, 4, 6, 8, 10, 12, 14, 16 |
HDI Techno- | For Sample | Run Production |
Board Thickness(Min) | 24mil | 24mil |
Board Thickness(Max) | 126mil | 126mil |
Copper Foil | ||
Copper foil outer layer | 1/2oz-10oz | 1/2oz-10oz |
Copper foil inner layer | 1/2oz-4oz | 1/2oz-4o/z |
Drill | ||
Plating hole tolerance | +/-3mil | +/-3mil |
Non-plating hole tolerance | +/-2mil | +/-2mil |
Min. Drill Bit | 0.25mm | 0.25mm |
Dielectric thickness | ||
Core thickness (Min) | 3mil | 3mil |
Dielectric thickness (prepreg) | 2mil | 2mil |
Finished board thickness tolerance | +/-10% FBT>=50mil
+/-12% 24mil=<FBT<50mil +/-3mil FBT<24mil |
+/-10% FBT>=50mil
+/-12% 24mil=<FBT<50mil +/-3mil FBT<24mil |
Solder mask | ||
Solder Mask Dam (Min) | 3mil | 3mil |
Solder Mask Opening (Min) | 2.5mil | 2.5mil |
Solder Mask plug hole size | 0.3mm-0.7mm | 0.25mm-0.7mm |
Registration Capability | ||
Layer to Layer | 3mil | 3mil |
Plating Capability | ||
Aspect Ratio (Mechanical) | 10 : 1 | 12 : 1 |
Aspect Ratio (Laser) | 0.8 : 1 | 0.8 : 1 |
Electrical / RF Capability | ||
Min line width/space (Inner ½ oz) | 4mil / 4mil | 4mil / 4mil |
Min line width/space (Inner 1oz) | 4mil / 4mil | 4mil / 4mil |
Min line width/space (Outer 1/2oz) | 4mil / 4mil | 4mil / 4mil |
Line tolerance | +/-20% | +/-20% |
Impedance | ||
Impedance Control | YES | YES |
Impedance Tolerance | +/-10% | +/-10% |
Outline | ||
Routing tolerance | +/-5mil | +/-5mil |
Punching tolerance | +/-4mil | +/-4mil |
V-cut angle | 30degree, 45degree, 60degree | 30degree, 45degree, 60degree |
V-cut tolerance | +/-3degree | +/-3degree |
V-cut web thickness tolerance | +/-3mil | +/-3mil |
Surface Finished | ||
OSP | Yes | Yes |
Immersion Gold | Yes | Yes |
Immersion Silver | Yes | Yes |
Lead Free HASL / HASL | Yes | Yes |
Immersion Tin | Yes | Yes |
E-Test | ||
Test Voltage | 25v-250v | 25v-250v |
Insolation resistance | 2M ohms- 100M ohms | 2M ohms- 100M ohms |
Continuity | 5 ohms – 1k ohms | 5 ohms – 1k ohms |