Recently, we have produced 16 layers HDI PCB with impedance control. The specification and board pictures are as following:

 


Technical Details:

The detailed Build-up as following (for reference only):


Layer Stack

Layer Name Material Thickness
1 Top Overlay    
2 Top Solder Dielectric 0.010 
3 L1 Copper 0.035 
4 Dielectricl1 IT-180A 1080 PP 0.069 
5 L2 Copper 0.020 
6 Dielectricl2 IT-180A 2116 PP 0.100 
7 L3 Copper 0.018 
8 Dielectricl3 IT-180A 0.09mm (exclud Cu) 0.090 
9 L4 Copper 0.018 
10 Dielectricl4 IT-180A 2116 PP 0.100 
11 L5 Copper 0.018 
12 Dielectricl5 IT-180A 0.09mm (exclud Cu) 0.090 
13 L6 Copper 0.018 
14 Dielectricl6 IT-180A 2116 PP 0.100 
15 L7 Copper 0.018 
16 Dielectricl 15 IT-180A 0.09mm (exclud Cu) 0.090 
17 L8 Copper 0.020 
18 Dielectricl 13 IT-180A 106*2 0.100 
19 L9 Copper 0.020 
20 Dielectricl7 IT-180A 0.09mm (exclud Cu) 0.090 
21 L10 Copper 0.018 
22 Dielectricl 14 IT-180A 2116 PP 0.100 
23 L11 Copper 0.018 
24 Dielectricl 12 IT-180A 0.09mm (exclud Cu) 0.090 
25 L12 Copper 0.018 
26 Dielectricl8 IT-180A 2116 PP 0.100 
27 L13 Copper 0.018 
28 Dielectricl9 IT-180A 0.09mm (exclud Cu) 0.090 
29 L14 Copper 0.018 
30 Dielectricl10 IT-180A 2116 PP 0.100 
31 L15 Copper 0.020 
32 Dielectricl11 IT-180A 1080 PP 0.069 
33 L16 Copper 0.035 
34 Bottom Solder Dielectric 0.010 
35 Bottom Overlay    
Finish thickness: 1.75mm +/-10%

 

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