^{16 layers HDI PCB, Tg170 base material, 2.23mm board thickness}

PCB Surface treatment: Immersion Gold (Chem. Ni/Au)

PCB Solder mask: Green *2

PCB Inner copper thickness: 0.5oz

PCB Finish outter copper thickness: 1.0oz

Profile: Milling

100% AOI and E-tested

Min track width/space: 0.1/0.1mm

^{4 layers PCB, Depth-milling, 1.10mm board thickness}

PCB Surface treatment: Immersion Gold (Chem. Ni/Au)

PCB Solder mask: Green *2

PCB Inner copper thickness: 0.5oz

PCB Finish outter copper thickness: 1.0oz

Profile: Milling

100% AOI and E-tested

Min track width/space: 0.18/0.15mm

Depth-Milling

^{3 layers PCB, Special stack-up, 1.60mm board thickness}

PCB Surface treatment: Lead Free HASL

PCB Solder mask: Green *2

PCB Inner copper thickness: 0.5oz

PCB Finish outter copper thickness: 1.0oz

Profile: Milling + V-cut

100% AOI and E-tested

Min track width/space: 0.2/0.2mm

Peelable Mask

^{4 layers PCB, Gold Plated Fingers, Special stack-up, 1.27mm board thickness}

PCB Surface treatment: Immersion Gold + Gold plated fingers

PCB Solder mask: Black *2

PCB Inner copper thickness: 1.0oz

PCB Finish outter copper thickness: 2.0oz

Profile: Milling + V-cut

100% AOI and E-tested

Min track width/space: 0.25/0.19mm

Copper thickness in hole: >30um, Au thickness on gold finger area: >0.5um

^{Rogers RO5880, IPC Class 3, Small round pcs, 1.60mm board thickness}

PCB Surface treatment: Immersion Gold

PCB Solder mask: No

PCB copper thickness: 1.0oz

Profile: Milling

100% E-tested

IPC Class 3